Kingston HyperX Impact 4GB 1600MHz DDR3L CL9 SODIMM Laptop RAM Memory

Kingston HyperX Impact 4GB 1600MHz DDR3L CL9 SODIMM Laptop RAM Memory

This is a brand new Kingston HyperX Impact 4GB 1600MHz DDR3L CL9 SODIMM. HyperX HX316LS9IB/4 is a 512M x 64-bit (4GB) DDR3L-1600 CL9 SDRAM (Synchronous DRAM) 1Rx8, low voltage, memory module, based on eight 512M x 8-bit DDR3 FBGA components. This module has been tested to run at DDR3L-1600 at a low latency timing of 9-9-9 at 1.35V or 1.5V. 

Product Specification:

• CL(IDD): 9 cycles
• Row Cycle Time (tRCmin): 48.125ns (min.)
• Refresh to Active/Refresh Command Time (tRFCmin): 260ns (min.)
• Row Active Time (tRASmin): 33.75ns (min.)
• Maximum Operating Power: TBD W* @1.35V
• UL Rating: 94 V - 0
• Operating Temperature: 0°C ~ 85°C
• Storage Temperature: -55°C ~ 100°C

FEATURES:

• JEDEC standard 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~1.575V) Power Supply
• VDDQ = 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V)
• 800MHz fCK for 1600Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 11, 10, 9, 8, 7, 6
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
• Asynchronous Reset
• PCB : Height 1.180” (30.00mm), double sided component